拓达教育 Touchdown Education 拓达求职支持办公室Career Support Office touchdown.org.cn ↗
JobFinder为留学生筛选身份匹配的岗位

Packaging Engineer Intern

Texas Instruments · Dallas, TX · 9月3日 · 今天开放
评分
95
发布日期
9月3日 (今天开放)
签证支持
支持 (该雇主近年 H-1B 批准 281 例)
内推
暂无
行业
半导体

岗位描述

Change the world. Love your job.

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

Put your talent to work with us as a Packaging Engineering Intern !

Minimum Requirements:

  • Currently pursuing a Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering or related.
  • Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications

  • Coursework or research in semiconductor packaging/fabrication
  • Experience with AutoCAD design and FEM modeling
  • Strong fundamentals in heat transfer, thermodynamics, and stress analysis
  • Experience with Semiconductor MEMS/3D integration design and fabrication
  • Project experience in the areas of: CVD, PVD, thin film deposition, electroplating, plasma etch, ML based package design, wafer bumping, or optical packaging
  • Experience with plating, adhesion, surface treatment process
  • Hands experience with semiconductor fabrication and characterization tools including VI Scopes, X-ray Inspection, materials characterization, and FA techniques
  • Strong written and verbal communication skills
  • Demonstrated analytical and problem solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for results

加入我的投递 →

Texas Instruments 的其他岗位

Analog IC Design Engineering Intern · Phoenix, AZ · Dallas, TX · Tucson, AZ · Knoxville, TN · 评分 95
Design Verification Engineer Intern - MS/PhD · Phoenix, AZ · Dallas, TX · Knoxville, TN · 评分 95
Digital IC Design Engineer Intern · Dallas, TX · Tucson, AZ · Knoxville, TN · 评分 95
Analog Design Engineer - Career Accelerator Program · Phoenix, AZ · Dallas, TX · Tucson, AZ · Knoxville, TN · 评分 89
Career Accelerator Program - Product Engineer · · 评分 58

查看全部 →